Intelligent Power Module (IPM) integrates a dedicated control IC with driver circuits and protection circuits, enabling more compact and simplified peripheral circuit design. The optimized performance matching between the control IC and power chips enhances module reliability and stability, while ensuring faster and more precise protection response.
IGBT(Insulated Gate Bipolar Transistor,简写IGBT)功率器件与VDMOS的差别在于n外延层下面不是n+层而是p+层。导通时在n型漂移区产生电导调制效应,大幅降低导通压降。
CoolSemi's SGT-MOSFET Power Devices Featuring an ultra-deep trench design with shielded gate connected to source, this innovative structure effectively: Eliminates majority of Qgd charge Significantly reduces Miller capacitance Enhances switching speed Lowers switching losses
Silicon Carbide Diodes (Schottky Barrier Diode, SBD) demonstrate significant advantages over conventional silicon diodes, including: Higher blocking voltage capability Near-zero reverse recovery charge Superior thermal stability Temperature-independent reverse recovery characteristics
Silicon Carbide MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), leveraging the material properties of silicon carbide, exhibit lower switching losses and higher operating frequencies, making them highly suitable for power electronics applications.
Gallium nitride high electron mobility transistor (GaN HEMT) devices use a pGaN architecture with a constant-off feature that offers an order of magnitude lower gate and output charge compared to their silicon (Si) counterparts, which, combined with a near-zero reverse recovery charge, can support simpler topologies and achieve higher system efficiency
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