FT3207 Chipset - Breaks through the heat dissipation bottleneck, activates AI performance, and improves cooling efficiency by 15%

In the 5G+AI era, computing power has exploded, and chip performance and heat generation have risen simultaneously. High-temperature frequency reduction, device aging, and experience degradation – traditional passive cooling is no longer able to cope with the computing power requirements of mobile terminals. Fortior Technology (stock code: 688279) has launched the FT3207, a fully integrated active cooling chip for mobile phones, reimagining the cooling paradigm with three major innovations：

Non-inductive sine wave drive technology

The chip adopts three-phase non-inductive sinusoidal drive, and the noise reduction can reach 1.6dB

Intelligent temperature control algorithm

Dynamically adjust the heat dissipation performance, and improve the chip performance

Full scene coverage

From the high load of the game to the continuous learning of AI, the whole process is temperature controllable

Heat dissipation is computing power

The FT3207 realizes the intelligent upgrade of the mobile phone cooling system through the active cooling control chip, providing long-lasting and stable performance output for high-load scenarios such as mobile phone AI applications and real-time dyeing

Active heat dissipation, the surface temperature of the mobile phone drops by 6°

Passive heat dissipation relies on heat conduction of the fuselage, and active heat dissipation can break through the limitations of the mobile phone's volume on heat dissipation capacity through the built-in fan of the mobile phone, as shown in the figure below, after 30 minutes of testing Genshin Impact games, turn on the built-in fan of the mobile phone for heat dissipation, and the surface temperature of the fuselage can drop directly6

Silent design, high energy noise reduction

FT3207 mobile phone active cooling chip solution, using three-phase motor and sinusoidal algorithm, FT3207's waveform is more sinusoidal (smaller window angle), compared with similar products, at the same speed (20000RPM), FT3207 compared with other fans TNR° (sound quality test index) reduced by 5.01dB, farewell to the annoying "hum" sound

Integrated and miniaturized design

The internal space of the mobile phone is compact, and the active cooling module may increase the thickness of the mobile phone (such as the thickness of the Red Magic 9Pro up to 8.9mm), which has a highly integrated demand for the driver chip. FT3207 is a fully integrated chip, integrated MOSFET, driver, LDO, comparator, peripheral devices only need one capacitor, the smallest package is only 1.75mm*1.75mm*0.37mm, (competitive chip package size: 3mm*3mm*0.5mm) to meet the needs of mobile phone miniaturization design

Dynamic adjustment of intelligent temperature control

Real-time response: Through temperature sensors and AI thermal management algorithms, the heat dissipation strategy can be dynamically adjusted (such as aggressive heat dissipation in gaming scenarios and silent operation during standby

FT3207 chip functions and parameters

1: Support RD output, FG, 1/3FG, 1/2FG, 2/3FG output

2: PWM frequency is wider 20HZ-62.5KHZ

3: Speed curve IDLE mode (PWM< 10% motor running at 10%)

4: The sine wave window is smaller, more sinusoidal, and the noise is lower

5: Short-circuit protection, any phase short-circuit of UVW can effectively protect the motor

Thermal Revolution for Sustainable Performance

The core value of the active cooling function is to exchange the controllable energy input for better thermal management and drive the intelligence of the chip. Efficiency is the key to achieving this balance. As the demand for mobile phone performance grows, active cooling will gradually penetrate from gaming phones to flagship models to the mid-range market

Fortior FT3207: Breaking the Thermal Limits of Smartphones with Chip-Level Innovation

Say goodbye to trade-offs between blazing performance and cool operation—from intense gaming to AI computing, experience no more throttling or lag, just sustained peak performance

This isn’t just a leap in cooling technology; it’s a new dimension in mobile experience.